Chips, Equipment, News | 08 February 2010

CEVA Forms Partnership with Many Telecomms

CEVA just accounced the CEVA-XCnet Partnership Program, a comprehensive group of third-party technology suppliers that form an infrastructure around the CEVA-XC communications processor for WiMax and LTE build out.

CEVA has a long history of forging strong partnerships with industry-leading technology suppliers that enable our mutual customers to develop full featured SoC products that meet specific market needs,”  said Eran Briman Vice President of Marketing at CEVA, “With the CEVA-XCnet Program we have taken this model to a new level, focusing specifically on the unique requirements of advanced wireless communications needs – LTE, WiMAX, HSPA+, SDR – and bringing together a wide array of expertise and technology that can be used to meet these very demanding development challenges.”

The processor is a top quality, low power consumption processor, perfect for SDR solutions including LTE and WiMax for mobile terminals and infrastructure. It accounts for the changing development needs of many standards of soft-modem solutions.

The Partnership program brings together different companies with many critical and complementary technologies including wireless software and hardware IPs for 3G and 4G applications. It can also provide for DSP software design services, RTOS, SoC level prototyping and simulation tools. CEVA-XCnet members get a comprehensive understanding of CEVA-XC architecture, development environment and libraries along with complete access to CEVA’s internal research and design team.

ArrayComm, Aricent, Carbon Design Systems, ENEA, IGP Communications, Lauterbach, mimoOn, P-Product, TurboConcept are the first to sign up for the program.

Photo Courtesy of Aranya Sen via Flickr

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Michael Licata

Michael works as a Content Manager for Quantum Networks and GoingMedia.net. He graduated in May with a degree in journalism/mass communications from St. Bonaventure University. He enjoys writing, learning and playing most sports.

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