Intel Corporation and Nokia signed a long-term relationship contract today to develop a new type of mobile computing device and chipset. The two companies also signed a licensing agreement that will enable Intel to license Nokia’s HSPA/3G modem technologies. These two contracts were signed as steps toward the creation of a new technological device for the mobile broadband market.
Intel and Nokia will combine high-bandwidth mobile broadband communication computers and ubiquitous Internet connectivity to create this new device. The name and the specifications of the device were not spelled out, however the companies claim that it will surpass any of the mobile devices that currently exist in the market. It will present a totally new type of hardware, software, and mobile Internet service that any of the smartphones, netbooks, or PCs already possess. In terms of physical appearance, the device will be in “pocketable form” to ensure a user-friendly, totally mobile experience.
“We will explore new ideas in designs, materials and displays that will go far beyond devices and services on the market today,” said Kai Oistamo, Executive Vice President, Devices, Nokia.
Intel and Nokia will collaborate in several Open Source softwares in order develop common technologies that can be used in the Moblin and Maemo platform projects, which will deliver Linux-based operating systems for the coming devices. The Open Source softwares will include oFono, ConnMan, Mozilla, X.Org, BlueZ, D-Bus, Tracker, GStreamer, and PulseAudio. The companies want to adapt their device to numerous softwares in order to deliver advanced Internet and communication experiences to their consumers, such as rich graphics and multimedia capabilities.
In addition, Intel agreed to license Nokia’s HSPA/3G modem technologies in order to develop mobile computing solutions that deliver a powerful and flexible computing experience.
Intel supports multiple broadband standards to provide constant Internet connection. Nokia’s modem will help expand Intel’s broadband wireless chipset solutions for mobility, which already combine Wi-Fi and WiMAX technology.
