Sequans Communications has licensed the CEVA-X1641 DSP core to power its next generation LTE and WiMax baseband processors. The X1641 DSP core will offer flexibility for Sequans’ next chips, while continuing the chips’ industry-leading low power rating.

“As the wireless industry continues to adopt a two-pronged approach towards 4G networks, it is critical that our next-generation product lines can support both LTE and WiMAX standards in a cost-efficient and flexible manner,” said Bertrand Debray, Sequans VP of engineering. “The high-performance CEVA-X1641 DSP provides us with a programmable architecture with low cost of deployment, addressing the major challenges facing 4G chipset solutions for high-volume markets. Also, with significant legacy software, the high efficiency of the CEVA-X1641 compiler was an important criterion in our decision to adopt a new DSP architecture.”

CEVA’s DSP cores power many of the world’s leading baseband handset solutions, with a broad customer base including Infineon, ST-Ericsson, Broadcom, Samsung, Mediatek, Spreadtrum and VIA Telecom. It recently announced its partnership program with telecommunications companies as well. CEVA shipped more than 600 million handsets.

The CEVA-X1641 and CEVA-XC DSP have been designed to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance WiMax, LTE and software definable radio wireless communications processors. CEVA has multiple licensees developing LTE handset and infrastructure solutions based on CEVA DSP cores.
Photo Courtesy of mtlin via Flickr